The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 30, 2020
Filed:
Nov. 05, 2015
Applicant:
Kyocera Corporation, Kyoto-shi, Kyoto, JP;
Inventors:
Assignee:
KYOCERA CORPORATION, Kyoto, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08L 63/04 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); C08L 63/00 (2006.01); H01L 23/29 (2006.01); C08L 91/06 (2006.01); C08L 61/06 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
C08L 63/04 (2013.01); C08L 61/06 (2013.01); C08L 63/00 (2013.01); C08L 91/06 (2013.01); H01L 21/56 (2013.01); H01L 23/00 (2013.01); H01L 23/29 (2013.01); H01L 23/293 (2013.01); H01L 23/31 (2013.01); C08L 2203/206 (2013.01); H01L 2924/0002 (2013.01); H01L 2924/186 (2013.01);
Abstract
A resin composition for semiconductor encapsulation, containing (A) an epoxy resin, (B) a phenolic resin-based curing agent, (C) an inorganic filler, and (D) amorphous carbon, wherein the amorphous carbon of the component (D) contains 30 atomic % or more of an SPstructure and 55 atomic % or less of an SPstructure.