The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 30, 2020
Filed:
Nov. 21, 2018
Shin-etsu Chemical Co., Ltd., Tokyo, JP;
Hiroyuki Iguchi, Annaka, JP;
Takayuki Kusunoki, Annaka, JP;
SHIN-ETSU CHEMICAL CO., LTD., Tokyo, JP;
Abstract
Addition-curable silicone composition providing cured product having good performance at low temperature and excellent resistance to a temperature change. Also, semiconductor device having high reliability, whose semiconductor element is encapsulated with a cured addition-curable silicone resin composition comprising (A) a branched organopolysiloxane of formula (1): wherein a is an integer of 2-100, b is an integer of 5-100, c is an integer of 5-100, 0.03≤a/(a+b)<1.0, and a ratio of (RRSiO) units to (RSiO) units is ≤2; (B) an organopolysiloxane of formula (2):(RSiO)(RSiO)(RSiO)(SiO)  (2)in an amount of 5-900 parts by mass, relative to 100 parts by mass of (A); (C) an organopolysiloxane having at least two hydrosilyl groups, in an amount such that a ratio of the number of the hydrosilyl groups in (C) to the number of the alkenyl groups in (A) and (B) is 0.4-4.0; and (D) a hydrosilylation catalyst in an amount sufficient to accelerate hydrosilylation.