The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 30, 2020
Filed:
Mar. 12, 2013
Applicant:
Daicel Corporation, Osaka-shi, Osaka, JP;
Inventors:
Assignee:
DAICEL CORPORATION, Osaka-Shi, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 59/24 (2006.01); C08K 3/04 (2006.01); C08G 65/08 (2006.01); C08G 59/68 (2006.01); G03F 7/038 (2006.01); G03F 7/004 (2006.01); C08G 59/32 (2006.01); C08G 59/22 (2006.01); C08L 47/00 (2006.01); C08L 67/00 (2006.01); C08L 69/00 (2006.01); G02B 1/04 (2006.01);
U.S. Cl.
CPC ...
C08G 59/24 (2013.01); C08G 59/22 (2013.01); C08G 59/32 (2013.01); C08G 59/68 (2013.01); C08G 59/687 (2013.01); C08G 59/688 (2013.01); C08K 3/04 (2013.01); C08L 47/00 (2013.01); C08L 67/00 (2013.01); C08L 69/00 (2013.01); G02B 1/04 (2013.01); G03F 7/0045 (2013.01); G03F 7/0046 (2013.01); G03F 7/038 (2013.01);
Abstract
Provided is a photosensitive resin composition that is, after being applied to an adherend surface, rapidly cured by photoirradiation to form a cured product having excellent light-shielding ability and adhesiveness (preferably, further having excellent reflow heat resistance). The photosensitive resin composition includes components (A), (C), and (D) and preferably further includes a component (B) as follows: