The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 30, 2020

Filed:

Mar. 14, 2019
Applicants:

Guoqiang LI, Baton Rouge, LA (US);

Harper Meng, Baton Rouge, LA (US);

Inventors:

Guoqiang Li, Baton Rouge, LA (US);

Harper Meng, Baton Rouge, LA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C04B 26/16 (2006.01); C04B 26/04 (2006.01); C08G 18/32 (2006.01); B29C 73/18 (2006.01); C04B 26/26 (2006.01); C04B 28/02 (2006.01); C04B 20/10 (2006.01); C08G 18/66 (2006.01); C08G 18/76 (2006.01); C08G 18/42 (2006.01); C08L 75/04 (2006.01); C08G 18/10 (2006.01); D01F 6/70 (2006.01); C04B 111/00 (2006.01); C04B 111/72 (2006.01); C04B 103/00 (2006.01); C08G 101/00 (2006.01); D01D 5/12 (2006.01);
U.S. Cl.
CPC ...
C04B 26/16 (2013.01); B29C 73/18 (2013.01); C04B 20/1037 (2013.01); C04B 26/04 (2013.01); C04B 26/26 (2013.01); C04B 28/02 (2013.01); C08G 18/10 (2013.01); C08G 18/3206 (2013.01); C08G 18/4238 (2013.01); C08G 18/664 (2013.01); C08G 18/7671 (2013.01); C08L 75/04 (2013.01); C04B 2103/0065 (2013.01); C04B 2111/00612 (2013.01); C04B 2111/72 (2013.01); C08G 2101/0025 (2013.01); C08G 2280/00 (2013.01); C08G 2350/00 (2013.01); D01D 5/12 (2013.01); D01F 6/70 (2013.01);
Abstract

A composition comprising thermoset polymer, shape memory polymer to facilitate macro scale damage closure, and a component for molecular scale healing has the ability to repair structural defects by a bio-mimetic, close-then-heal process. The shape memory polymer serves to bring surfaces of a structural defect into proximity, after which the healing component moves into the defect and provides molecular scale healing. The component for molecular scale healing can be a thermoplastic, such as fibers, particles or spheres, which are heated to or above the thermoplastic's melting point, and then the composition is cooled below that melting temperature. The compositions can not only close macroscopic defects, but they can also do so repeatedly even if damage recurs in a previously healed/repaired area.


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