The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 30, 2020
Filed:
May. 23, 2017
Applicant:
Hitachi Metals, Ltd., Tokyo, JP;
Inventors:
Masayuki Yokota, Suita, JP;
Ryoji Inoue, Suita, JP;
Yoshiharu Tsuboi, Suita, JP;
Masaharu Yamamoto, Suita, JP;
Masaru Fujiyoshi, Yasugi, JP;
Naruaki Tomita, Tokyo, JP;
Kouji Kawahara, Tokyo, JP;
Assignee:
HITACHI METALS, LTD., Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
C22C 38/08 (2006.01); C22C 38/40 (2006.01); C22C 38/52 (2006.01); C22C 38/10 (2006.01); C03C 27/08 (2006.01); B32B 15/04 (2006.01); B32B 17/06 (2006.01); C03C 27/04 (2006.01); C22C 30/00 (2006.01); C22C 19/05 (2006.01); E06B 3/673 (2006.01);
U.S. Cl.
CPC ...
C03C 27/08 (2013.01); B32B 15/04 (2013.01); B32B 17/06 (2013.01); B32B 17/061 (2013.01); C03C 27/042 (2013.01); C22C 19/058 (2013.01); C22C 30/00 (2013.01); C22C 38/08 (2013.01); C22C 38/105 (2013.01); C22C 38/40 (2013.01); C22C 38/52 (2013.01); E06B 3/67334 (2013.01);
Abstract
This glass bonding material () is made of a cladding material () in which at least a first layer () made of an Al-based alloy and configured to be bonded to glass and a second layer () made of an Fe—Ni based alloy having a thermal expansion coefficient from 30° C. to 400° C. of 11.5×10(K) or less are bonded.