The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 30, 2020

Filed:

Jun. 13, 2018
Applicant:

Cirrus Logic International Semiconductor Ltd., Edinburgh, GB;

Inventors:

Aleksey Sergeyevich Khenkin, Nashua, NH (US);

David Patten, Austin, TX (US);

Assignee:

Cirrus Logic, Inc., Austin, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B81B 7/00 (2006.01); H04R 19/04 (2006.01);
U.S. Cl.
CPC ...
B81B 7/0058 (2013.01); B81B 7/0061 (2013.01); H04R 19/04 (2013.01); B81B 2201/0257 (2013.01); B81B 2207/096 (2013.01); H04R 2201/003 (2013.01); H04R 2499/11 (2013.01);
Abstract

The application describes a package for a MEMS transducer. The package has a package substrate having an acoustic port formed in the package substrate. The acoustic port comprises a first acoustic port volume portion and a second acoustic port volume portion, the first acoustic port volume portion being separated from the second acoustic port volume potion by a discontinuity in a sidewall of the substrate. The cross sectional area of the first acoustic port volume portion is greater than the cross sectional area of the second acoustic port volume portion. A barrier may be attached to the upper surface of the package substrate so as to seal or cover the acoustic port.


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