The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 30, 2020
Filed:
Jun. 06, 2018
Applicant:
Solutia Inc., St. Louis, MO (US);
Inventors:
Aristotelis Karagiannis, Amherst, MA (US);
Megan L. Szlosek, Granby, MA (US);
Yalda Farhoudi, Longmeadow, MA (US);
Assignee:
Solutia Inc., St. Louis, MO (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 17/10 (2006.01); B32B 7/02 (2019.01); B32B 27/08 (2006.01); B32B 27/22 (2006.01); B32B 27/30 (2006.01); B32B 27/36 (2006.01); C08L 1/00 (2006.01);
U.S. Cl.
CPC ...
B32B 17/1055 (2013.01); B32B 7/02 (2013.01); B32B 17/10605 (2013.01); B32B 17/10761 (2013.01); B32B 27/08 (2013.01); B32B 27/22 (2013.01); B32B 27/306 (2013.01); B32B 27/36 (2013.01); B32B 2250/246 (2013.01); B32B 2250/40 (2013.01); B32B 2307/412 (2013.01); B32B 2307/418 (2013.01); B32B 2307/546 (2013.01); B32B 2307/548 (2013.01); B32B 2307/558 (2013.01); B32B 2307/732 (2013.01); B32B 2419/00 (2013.01); B32B 2457/12 (2013.01); B32B 2551/00 (2013.01); B32B 2605/006 (2013.01); B32B 2607/02 (2013.01); C08L 1/00 (2013.01);
Abstract
A multilayer interlayer structure having a low M/high Tg layer and a high Mlayer, the interlayer having a high E' modulus and a higher Tg. The high Tg layer has a Tg of at least 50° C. and a weight average molecular weight of not more than 160,000. The high Mlayer has a molecular weight greater than 160,000. The interlayer structure has increased stiffness without having to increase its thickness, and has an increased Tg to enable the structure to be used in applications that require good modulus at outdoor temperatures.