The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 30, 2020

Filed:

Dec. 28, 2018
Applicants:

Shenzhen Futaihong Precision Industry Co., Ltd., Shenzhen, CN;

Fih (Hong Kong) Limited, Kowloon, HK;

Inventors:

Guo-Liang Wan, Shenzhen, CN;

Yan-Min Wang, Shenzhen, CN;

Dian-Hong Wei, Shenzhen, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 45/14 (2006.01); H05K 5/04 (2006.01); H05K 5/00 (2006.01); B29L 31/34 (2006.01); B29K 101/12 (2006.01); B29K 705/00 (2006.01);
U.S. Cl.
CPC ...
B29C 45/14311 (2013.01); H05K 5/0017 (2013.01); H05K 5/04 (2013.01); B29K 2101/12 (2013.01); B29K 2705/00 (2013.01); B29L 2031/3481 (2013.01);
Abstract

A housing for an electronic device includes a metal member combined with a plastic member. The combination molds the metal member to the plastic member but the plastic member is discontinuous and recesses and protrusions are cut into the metal member to enable molding and bonding with the plastic member in the manner of a dovetail joint. Manufacture in this way increases bonding strength and reduces the likelihood of internal stresses in the cooling plastic member resulting from complete envelopment of the metal by the plastic. The metal member and the plastic member are thus integrally formed and a thickness of a recess is less than a thickness of the plastic member. An electronic device and a method for making the housing are also provided.


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