The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 30, 2020

Filed:

Dec. 13, 2018
Applicant:

Nisshin Steel Co., Ltd., Chiyoda-ku, Tokyo, JP;

Inventors:

Yoshiaki Hori, Tokyo, JP;

Kazunari Imakawa, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 35/30 (2006.01); C22C 38/00 (2006.01); C22C 38/58 (2006.01); C22C 38/34 (2006.01); C22C 38/44 (2006.01); C22C 38/42 (2006.01); B23K 101/14 (2006.01); C22C 38/50 (2006.01); C22C 38/46 (2006.01); C22C 38/54 (2006.01); C22C 38/06 (2006.01); C22C 38/48 (2006.01);
U.S. Cl.
CPC ...
B23K 35/3086 (2013.01); C22C 38/001 (2013.01); C22C 38/34 (2013.01); C22C 38/58 (2013.01); B23K 2101/14 (2018.08); C22C 38/002 (2013.01); C22C 38/005 (2013.01); C22C 38/06 (2013.01); C22C 38/42 (2013.01); C22C 38/44 (2013.01); C22C 38/46 (2013.01); C22C 38/48 (2013.01); C22C 38/50 (2013.01); C22C 38/54 (2013.01);
Abstract

Provided is a stainless steel material for a diffusion bonding jig in which deformation of bonding members is suppressed while maintaining diffusion bonding properties of the bonding members, and in which releasability (detachability of a bonding member from a release member) after diffusion bonding treatment is excellent. An embodiment of the present invention provides a stainless steel material for a diffusion bonding jig having excellent deformation suppressibility and releasability, the material being a stainless steel material including 1.5 mass % or more of Si, and a ratio (Fr/Fp) of the high-temperature strength (Fr) of the stainless steel material at 1000° C. to the high-temperature strength (Fp) of a bonding member at 1000° C. being 0.9 or more, the bonding member to be bonded by diffusion bonding. The stainless steel material preferably includes C: 0.1 mass % or less, Si: 1.5 to 5.0 mass %, Mn: 2.5 mass % or less, P: 0.06 mass % or less, S: 0.02 mass % or less, Ni: 8.0 to 15.0 mass %, Cr: 13.0 to 23.0 mass %, and N: 0.2 mass % or less.


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