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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10695854 B1

PDFFull Text
Date of Patent:
Jun. 30, 2020

Filed:

Mar. 27, 2015

Method of seamless bonding and device therefor

Applicant:

Pratt & Whitney Canada Corp., Longueuil, CA;

Inventor:

Pierre Verrier, Sainte-Julie, CA;

Assignee:

PRATT & WHITNEY CANADA CORP., Longueuil, Quebec, unknown;

Attorney:

Norton Rose Fulbright Canada LLP

Primary Examiner:

Dana Ross

Assistant Examiner:

Joseph M Baillargeon

Int. Cl.
CPC ...
B23K 3/08 (2006.01); B23K 26/06 (2014.01); B23K 26/0622 (2014.01); B23K 26/142 (2014.01); B23K 26/361 (2014.01); B23K 1/00 (2006.01); B23K 9/173 (2006.01); B23K 26/08 (2014.01); B23K 101/32 (2006.01); B23K 101/00 (2006.01); B23K 9/167 (2006.01);
U.S. Cl.
CPC ...
B23K 3/08 (2013.01); B23K 1/0018 (2013.01); B23K 9/167 (2013.01); B23K 9/173 (2013.01); B23K 26/0619 (2015.10); B23K 26/0622 (2015.10); B23K 26/083 (2013.01); B23K 26/142 (2015.10); B23K 26/361 (2015.10); B23K 2101/001 (2018.08); B23K 2101/32 (2018.08);
Abstract

A method of seamless bonding comprises in sequence: feeding a filler wire into a de-scaling unit; removing with the de-scaling unit a contamination layer disposed onto a core of the filler wire, removing the contamination layer comprising: applying a laser beam to the filler wire at a wavelength causing at least a portion of the contamination layer to break away from the core of the filler wire while leaving the core unaffected; and feeding the filler wire to a seamless bonding unit. A seamless bonding device is also presented.

Find Patent Forward Citations

Verrier, Pierre. (2020). Method of seamless bonding and device therefor (U.S. Patent No. 10695854). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10695854

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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