The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 23, 2020
Filed:
Feb. 08, 2018
Applicant:
Murata Manufacturing Co., Ltd., Kyoto, JP;
Inventors:
Akinori Hamada, Nagaokakyo, JP;
Yoshimasa Yoshioka, Nagaokakyo, JP;
Yoshinori Taguchi, Nagaokakyo, JP;
Ryuichiro Tominaga, Nagaokakyo, JP;
Assignee:
Murata Manufacturing Co., Ltd., Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H02M 3/00 (2006.01); H05K 1/16 (2006.01); H01F 27/24 (2006.01); H05K 1/18 (2006.01); H01F 27/28 (2006.01); H05K 3/46 (2006.01); H01F 41/04 (2006.01); H02M 3/155 (2006.01); H01F 17/04 (2006.01); H01F 17/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/165 (2013.01); H01F 17/0013 (2013.01); H01F 17/04 (2013.01); H01F 27/24 (2013.01); H01F 27/2804 (2013.01); H01F 41/043 (2013.01); H02M 3/00 (2013.01); H02M 3/155 (2013.01); H05K 1/18 (2013.01); H05K 3/4652 (2013.01); H05K 3/4682 (2013.01); H01F 2017/048 (2013.01); H01F 2027/2809 (2013.01); H05K 3/4676 (2013.01); H05K 2201/0215 (2013.01); H05K 2201/086 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10053 (2013.01);
Abstract
A printed wiring board comprises a sheet-shaped core base material containing a magnetic material, a coil disposed inside the core base material, and an external circuit layer disposed on at least one of first and second surfaces of the core base material opposite to each other.