The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 23, 2020
Filed:
Sep. 10, 2019
Applicants:
Inventec (Pudong) Technology Corporation, Shanghai, CN;
Inventec Corporation, Taipei, TW;
Inventors:
Chi-Zen Peng, Taipei, TW;
Chia-Chen Chen, Taipei, TW;
Pin-Chang Chu, Taipei, TW;
Ting-Yuan Lin, Taipei, TW;
Assignees:
INVENTEC (PUDONG) TECHNOLOGY CORPORATION, Shanghai, CN;
INVENTEC CORPORATION, Taipei, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 1/16 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01); H04N 5/225 (2006.01); H04R 1/02 (2006.01); H01R 12/72 (2011.01);
U.S. Cl.
CPC ...
H05K 1/0278 (2013.01); G06F 1/1616 (2013.01); G06F 1/1684 (2013.01); G06F 1/1686 (2013.01); H04N 5/2252 (2013.01); H04N 5/2253 (2013.01); H04R 1/02 (2013.01); H05K 1/189 (2013.01); H01R 12/722 (2013.01); H04R 2201/02 (2013.01); H04R 2499/15 (2013.01); H05K 2201/10083 (2013.01); H05K 2201/10121 (2013.01); H05K 2201/10128 (2013.01); H05K 2201/10189 (2013.01);
Abstract
An image capturing assembly including a composite circuit board, an image capturing component and a first audio component. The composite circuit board includes a hard board part and a first flexible board part that are directly connected to each other. The image capturing component is disposed on and electrically connected to the hard board part. The first audio component is disposed on and electrically connected to the first flexible board part.