The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 23, 2020

Filed:

Oct. 18, 2018
Applicant:

Commscope Technologies Llc, Hickory, NC (US);

Inventors:

Pengfei Guo, Suzhou, CN;

Ligang Wu, Suzhou, CN;

Hangsheng Wen, Suzhou, CN;

Jun Sun, Suzhou, CN;

Assignee:

CommScope Technologies LLC, Hickory, NC (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04M 1/00 (2006.01); H04W 16/28 (2009.01); H01Q 21/06 (2006.01); H01Q 1/24 (2006.01); H04B 7/0408 (2017.01); H01P 5/08 (2006.01);
U.S. Cl.
CPC ...
H04W 16/28 (2013.01); H01P 5/085 (2013.01); H01Q 1/246 (2013.01); H01Q 21/065 (2013.01); H04B 7/0408 (2013.01);
Abstract

An antenna assembly includes a substrate having front and back surfaces thereon and a plurality of through-holes therein, along with a solder pad on the back surface of the substrate. An input cable is also provided, which is attached to the back surface of the substrate. The input cable includes an outer conductor, which contacts the back surface of the substrate, and an inner conductor, which extends at least partially through a first of the plurality of through-holes and is electrically connected to the solder pad. A metal trace (e.g., 50-ohm trace) is provided on the front surface of the substrate. The metal trace is electrically connected to the solder pad by electrically conductive plating in a second of the plurality of through-holes.


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