The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 23, 2020
Filed:
Mar. 25, 2019
Applicant:
Fortemedia, Inc., Santa Clara, CA (US);
Inventors:
Hsin-Li Lee, Tainan, TW;
Jien-Ming Chen, Tainan, TW;
Wen-Shan Lin, Tainan, TW;
Nai-Hao Kuo, Tainan, TW;
Feng-Chia Hsu, Kaohsiung, TW;
Assignee:
FORTEMEDIA, INC., Santa Clara, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H04R 19/04 (2006.01); B81B 7/00 (2006.01);
U.S. Cl.
CPC ...
H04R 19/04 (2013.01); B81B 7/0061 (2013.01); B81B 2201/0257 (2013.01); B81B 2203/0315 (2013.01); B81B 2203/0353 (2013.01); B81B 2207/012 (2013.01); B81B 2207/098 (2013.01); H04R 2201/003 (2013.01);
Abstract
A MEMS microphone package includes a substrate, a transducer, an integrated circuit chip, and a housing. The substrate has a hollow chamber, a first opening and a second opening, wherein the first opening and the second opening communicate with the hollow chamber. The transducer is disposed on the substrate. The integrated circuit chip is disposed on the substrate. The housing is disposed on the substrate, and covers the integrated circuit chip and the transducer.