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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10693438 B1

PDFFull Text
Date of Patent:
Jun. 23, 2020

Filed:

Oct. 20, 2017

Acoustic wave resonator and method for manufacturing the same

Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;

Inventors:

Yeong Gyu Lee, Suwon-si, KR;

Sung Won Im, Suwon-si, KR;

Dong Woon Chang, Suwon-si, KR;

Hyung Goo Baek, Suwon-si, KR;

Assignee:

Samsung Electro-Mechanics Co., Ltd., Suwon-si, KR;

Attorney:

NSIP Law

Primary Examiner:

Bryan P Gordon

Int. Cl.
CPC ...
H03H 9/05 (2006.01); H03H 9/02 (2006.01); H03H 9/54 (2006.01); H03H 9/10 (2006.01); H03H 9/17 (2006.01); H03H 3/04 (2006.01); H01L 23/00 (2006.01); H01L 41/047 (2006.01); H01L 41/29 (2013.01); H03H 3/02 (2006.01);
U.S. Cl.
CPC ...
H03H 9/0514 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 41/0475 (2013.01); H01L 41/29 (2013.01); H03H 3/02 (2013.01); H03H 3/04 (2013.01); H03H 9/0211 (2013.01); H03H 9/02133 (2013.01); H03H 9/105 (2013.01); H03H 9/1014 (2013.01); H03H 9/173 (2013.01); H03H 9/174 (2013.01); H03H 9/547 (2013.01); H01L 2224/02206 (2013.01); H01L 2224/02215 (2013.01); H01L 2224/03424 (2013.01); H01L 2224/03464 (2013.01); H01L 2224/05144 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/05564 (2013.01); H01L 2224/05582 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/05655 (2013.01); H01L 2924/05042 (2013.01); H01L 2924/05432 (2013.01); H01L 2924/05442 (2013.01); H01L 2924/35121 (2013.01); H03H 2003/021 (2013.01); H03H 2003/023 (2013.01);
Abstract

An acoustic wave resonator includes: a substrate; a resonating portion formed on a first surface of the substrate; a metal pad connected to the resonating portion through a via hole formed in the substrate; and a protective layer disposed on a second surface of the substrate and including a plurality of layers, wherein the plurality of layers includes an internal protective layer directly in contact with the second surface of the substrate and formed of an insulating material including an adhesion that is stronger than an adhesion of other layers, among the plurality of layers.

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