The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 23, 2020

Filed:

Jul. 14, 2016
Applicant:

Gridtential Energy, Inc., Santa Clara, CA (US);

Inventors:

Daniel Jason Moomaw, Santa Clara, CA (US);

Collin Kwok Leung Mui, Mountain View, CA (US);

Esteban M. Hinojosa, San Jose, CA (US);

Assignee:

Gridtential Energy, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01M 4/66 (2006.01); H01M 4/68 (2006.01); H01M 4/14 (2006.01); H01M 10/18 (2006.01); H01M 10/04 (2006.01); H01M 10/12 (2006.01); H01M 2/02 (2006.01); H01M 4/73 (2006.01); H01M 4/82 (2006.01); H01M 4/16 (2006.01); H01M 4/02 (2006.01);
U.S. Cl.
CPC ...
H01M 4/685 (2013.01); H01M 2/024 (2013.01); H01M 4/14 (2013.01); H01M 4/66 (2013.01); H01M 4/68 (2013.01); H01M 4/73 (2013.01); H01M 4/82 (2013.01); H01M 10/0418 (2013.01); H01M 10/0486 (2013.01); H01M 10/12 (2013.01); H01M 10/18 (2013.01); H01M 4/16 (2013.01); H01M 4/661 (2013.01); H01M 4/667 (2013.01); H01M 2004/029 (2013.01);
Abstract

A current collector assembly, such as for a bipolar lead acid battery, can include an electrically-conductive silicon substrate and a frame bonded to the electrically-conductive silicon substrate. The substrate can be treated or modified, such as to include one or more thin films which render a surface substrate electrically conductive and electrochemically stable in the presence of a lead acid electrolyte chemistry. An interface between the frame and the electrically-conductive silicon substrate can be hermetically sealed. In an example, the frame can provide an edge-seal ring configuration. In an example, a casing assembly can include a spacer bonded to the substrate, along with a casing segment and a thermally-conductive rib, the spacer isolating the thermally-conductive rib from the electrically-conductive silicon substrate electrically.


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