The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 23, 2020
Filed:
Aug. 08, 2017
Applicant:
Sharp Kabushiki Kaisha, Sakai, Osaka, JP;
Inventors:
Katsuyuki Suga, Sakai, JP;
Yuki Yasuda, Sakai, JP;
Assignee:
SHARP KABUSHIKI KAISHA, Sakai, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 51/56 (2006.01); B32B 43/00 (2006.01); H01L 51/00 (2006.01); H01L 27/32 (2006.01);
U.S. Cl.
CPC ...
H01L 51/003 (2013.01); B32B 43/006 (2013.01); H01L 27/3244 (2013.01); H01L 51/0097 (2013.01); H01L 51/56 (2013.01); B32B 2457/206 (2013.01); H01L 2227/326 (2013.01); H01L 2251/5338 (2013.01); Y10T 156/1158 (2015.01); Y10T 156/1184 (2015.01); Y10T 156/1917 (2015.01); Y10T 156/1967 (2015.01);
Abstract
Provided is a method for manufacturing an EL device, the method including peeling a mother substrate from a layered body including a light-emitting element layer with irradiation with a laser. The mother substrate and the layered body are in contact with each other with a resin layer of the layered body interposed therebetween, and in a case that the peeling is performed by irradiating the resin layer with the laser, the irradiation is performed on at least a part of an end portion of the resin layer under a condition different from that in a central portion of the resin layer.