The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 23, 2020
Filed:
Sep. 07, 2018
Applicant:
Azurewave Technologies, Inc., New Taipei, TW;
Inventors:
Assignee:
AZUREWAVE TECHNOLOGIES, INC., New Taipei, TW;
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/146 (2006.01); H01S 5/022 (2006.01); H01S 5/183 (2006.01); H01L 33/48 (2010.01); H01L 33/58 (2010.01); H01L 33/62 (2010.01); H01L 31/0203 (2014.01); H01L 31/0232 (2014.01); H01L 31/02 (2006.01);
U.S. Cl.
CPC ...
H01L 27/14618 (2013.01); H01L 27/14625 (2013.01); H01L 27/14636 (2013.01); H01L 31/02002 (2013.01); H01L 31/0203 (2013.01); H01L 31/02327 (2013.01); H01L 33/483 (2013.01); H01L 33/58 (2013.01); H01L 33/62 (2013.01); H01S 5/0228 (2013.01); H01S 5/02208 (2013.01); H01S 5/02288 (2013.01); H01S 5/183 (2013.01);
Abstract
An optical module includes an electronic assembly and an optical component. The electronic assembly includes a chip component and a circuit board. The optical assembly disposed on the electronic assembly includes a bracket and an optical component. The bracket surrounds the chip component and has at least two conductive layers separated from each other. The conductive layers extend to the bottom of the bracket and are electrically connected to the electronic assembly. The optical assembly is disposed on the bracket and has at least one light-transmissive conductive layer which is electrically connected to the conductive layers.