The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 23, 2020

Filed:

Dec. 02, 2014
Applicant:

3m Innovative Properties Company, St. Paul, MN (US);

Inventors:

Ravi Palaniswamy, Singapore, SG;

Jian Xia Gao, Singapore, SG;

Alejandro Aldrin A. Narag, II, Singapore, SG;

Nathan P. Kreutter, Austin, TX (US);

Andrew J. Ouderkirk, St. Paul, MN (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/64 (2010.01); H01L 25/075 (2006.01); H05K 1/18 (2006.01); H05K 1/02 (2006.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
H01L 25/0753 (2013.01); H01L 33/62 (2013.01); H01L 33/642 (2013.01); H01L 33/644 (2013.01); H05K 1/0206 (2013.01); H05K 1/189 (2013.01); H01L 33/64 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/49176 (2013.01); H05K 2201/09827 (2013.01); H05K 2201/10106 (2013.01); H05K 2203/049 (2013.01);
Abstract

A flexible polymeric dielectric layer () having first and second major surfaces, the first major surface having a conductive layer () thereon, the dielectric layer having at least one conduit () extending from the second major surface to the first major surface, the conduit having at least one lateral dimension of at least about one centimeter and being at least partially filled with conductive material (), the conductive layer including at least one conductive feature () substantially aligned with the conduit (), the conductive feature () supporting a plurality of light emitting semiconductor devices ().


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