The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 23, 2020

Filed:

Dec. 22, 2017
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Inventors:

Youngsik Kim, Cheonan-si, KR;

Doojin Kim, Asan-si, KR;

Seokho Lee, Asan-si, KR;

Younggon Hwang, Cheonan-si, KR;

Assignee:

SAMSUNG ELECTRONICS CO., LTD., Suwon-si, Gyeonggi-Do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); B23K 3/02 (2006.01);
U.S. Cl.
CPC ...
H01L 24/78 (2013.01); B23K 3/02 (2013.01); H01L 24/85 (2013.01); H01L 24/45 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/48463 (2013.01); H01L 2224/78308 (2013.01); H01L 2224/78611 (2013.01); H01L 2224/859 (2013.01); H01L 2224/85205 (2013.01); Y10T 29/5337 (2015.01); Y10T 29/53435 (2015.01); Y10T 29/53543 (2015.01);
Abstract

A method for replacing a capillary of a wire bonding apparatus that includes a holding unit that holds a capillary includes transferring a capillary replacing unit to the wire bonding apparatus by a mobile robot in response to receiving a capillary replacement start signal from the wire bonding apparatus, separating, by the capillary replacing unit, the capillary corresponding to the replacement signal from the wire bonding apparatus, and installing, by the capillary replacing unit, a new capillary in the wire bonding apparatus.


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