The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 23, 2020

Filed:

Feb. 21, 2019
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Nicholas T. Bronn, Long Island City, NY (US);

Jared B. Hertzberg, Yorktown Heights, NY (US);

Eric P. Lewandowski, White Plains, NY (US);

Jae-woong Nah, Closter, NJ (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); G06N 10/00 (2019.01); H01L 23/66 (2006.01); H01L 21/66 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 24/14 (2013.01); G06N 10/00 (2019.01); H01L 22/12 (2013.01); H01L 22/22 (2013.01); H01L 23/49811 (2013.01); H01L 23/66 (2013.01); H01L 24/81 (2013.01); H01L 24/97 (2013.01);
Abstract

According to an embodiment of the present invention, a method of producing a quantum computer chip includes performing a frequency measurement on a qubit chip bonded to a test interposer chip for qubits on the qubit chip at an operating temperature of the qubit chip. The method further includes pulling the qubit chip apart from the test interposer chip after performing the frequency measurement, and modifying a frequency of a subset of qubits after pulling the qubit chip apart from the test interposer chip. The method further includes bonding the qubit chip to a device interposer chip after modifying the frequency of the subset of qubits.


Find Patent Forward Citations

Loading…