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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10692820 B1

PDFFull Text
Date of Patent:
Jun. 23, 2020

Filed:

Nov. 21, 2018

Hybrid composite film, method of fabricating the same, and integrated circuit device including hybrid composite film

Applicant:

Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Inventors:

Seung-won Kim, Hwaseong-si, KR;

Jun-won Han, Seoul, KR;

Yeon-woo Kim, Hwaseong-si, KR;

Hye-yun Park, Hwaseong-si, KR;

Cheol-sang Yoon, Seoul, KR;

Kangtaek Lee, Seoul, KR;

Hyungjoon Jeon, Seoul, KR;

Young-Geon Song, Seoul, KR;

Assignees:

SAMSUNG ELECTRONICS CO., LTD., Suwon-si, Gyeonggi-do, KR;

Industry-Academic Cooperation Foundation, Yonsei University, Seoul, KR;

Attorney:

Lee IP Law, P.C.

Primary Examiner:

Ly D Pham

Int. Cl.
CPC ...
C01G 53/00 (2006.01); H01M 4/505 (2010.01); H01M 4/525 (2010.01); C01B 39/48 (2006.01); H01M 10/0525 (2010.01); H01L 23/00 (2006.01); H01L 21/02 (2006.01); H01L 23/373 (2006.01); C09C 1/04 (2006.01); C09C 3/08 (2006.01); H01L 23/498 (2006.01); C09C 3/12 (2006.01); C09D 179/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/562 (2013.01); C09C 1/04 (2013.01); C09C 3/08 (2013.01); C09C 3/12 (2013.01); C09D 179/00 (2013.01); H01L 21/02118 (2013.01); H01L 21/02282 (2013.01); H01L 23/3737 (2013.01); H01L 23/49811 (2013.01); H01L 23/49833 (2013.01); C01P 2002/70 (2013.01); C01P 2002/84 (2013.01); C01P 2004/03 (2013.01); C01P 2004/04 (2013.01); C01P 2004/62 (2013.01); C01P 2004/64 (2013.01); H01L 2224/18 (2013.01);
Abstract

A hybrid composite film, a method of fabricating the hybrid composite film, and an integrated circuit device including the hybrid composite film, the hybrid composite film including a polymer film; and a plurality of organic-inorganic composite particles dispersed in the polymer film, wherein each particle of the plurality of organic-inorganic composite particles includes an inorganic particle and an organic capping layer surrounding the inorganic particle, the organic capping layer having a hydroxyl group-terminated end.

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