The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 23, 2020

Filed:

Feb. 26, 2019
Applicant:

AU Optronics Corporation, Hsinchu, TW;

Inventors:

Chang-Hui Wu, Hsinchu, TW;

Yu-Huei Jiang, Hsinchu, TW;

Hsiao-Chung Cheng, Tainan, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/4985 (2013.01); H01L 23/49838 (2013.01); H01L 24/50 (2013.01);
Abstract

A chip-on-film (COF) package structure includes a first COF and a second COF. The first COF includes a first flexible substrate having a first external terminal and a first internal terminal opposite to each other, first outer leads disposed at the first external terminal, first inner leads disposed at the first internal terminal, and a first chip disposed between the first external terminal and the first internal terminal. The second COF includes a second flexible substrate having a second external terminal and a second internal terminal opposite to each other, second outer leads disposed at the second external terminal, second inner leads disposed at the second internal terminal, and a second chip disposed between the second external terminal and the second internal terminal. The first COF is partially overlapped with the second COF. A display device having the COF package structure is also provided.


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