The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 23, 2020

Filed:

Dec. 01, 2017
Applicant:

Global Standard Technology Co., Ltd., Hwaseong-si, Gyeonggi-do, KR;

Inventors:

Jong Bae Kim, Yongin-si, KR;

Seung Jin Yang, Seoul, KR;

Jae Suk Heo, Hwaseong-si, KR;

Chi Won Choi, Goyang-si, KR;

Je Min Kim, Chuncheon-si, KR;

Hyeung Kwan Kim, Suwon-si, KR;

Yong Ho Choi, Ansan-si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/683 (2006.01); B23Q 3/15 (2006.01); H01L 21/67 (2006.01); H01L 21/205 (2006.01); H01L 21/3065 (2006.01); G01K 1/14 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6831 (2013.01); B23Q 3/15 (2013.01); G01K 1/14 (2013.01); H01L 21/205 (2013.01); H01L 21/3065 (2013.01); H01L 21/67017 (2013.01); H01L 21/67103 (2013.01); H01L 21/67109 (2013.01); H01L 21/67248 (2013.01);
Abstract

The present invention relates to a high-tech temperature control device for a semiconductor manufacturing facility and, more specifically, to a high-tech temperature control device for an electrostatic chuck, which supports a wafer and maintains the temperature in a semiconductor wafer processing process. It is possible to very precisely control a temperature of an electrostatic chuck by maintaining temperatures and a mixing flow rate of a heating heat medium and a cooling heat medium constant and adjusting a mixing ratio. Meanwhile, the heat medium after heating and cooling is collected and reused, thereby efficiently using energy.


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