The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 23, 2020
Filed:
Oct. 27, 2017
Applicant:
Yageo Corporation, Kaohsiung, TW;
Inventor:
Masayuki Fujimoto, Kaohsiung, TW;
Assignee:
YAGEO CORPORATION, Kaohsiung, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/12 (2006.01); C04B 35/626 (2006.01); C04B 35/634 (2006.01); C04B 35/64 (2006.01); C04B 35/49 (2006.01); C04B 35/465 (2006.01); C04B 35/486 (2006.01); C04B 35/46 (2006.01);
U.S. Cl.
CPC ...
H01G 4/1272 (2013.01); C04B 35/46 (2013.01); C04B 35/465 (2013.01); C04B 35/486 (2013.01); C04B 35/49 (2013.01); C04B 35/6261 (2013.01); C04B 35/6264 (2013.01); C04B 35/62645 (2013.01); C04B 35/62655 (2013.01); C04B 35/62695 (2013.01); C04B 35/63416 (2013.01); C04B 35/64 (2013.01); C04B 2235/3206 (2013.01); C04B 2235/3208 (2013.01); C04B 2235/3213 (2013.01); C04B 2235/3215 (2013.01); C04B 2235/3225 (2013.01); C04B 2235/3227 (2013.01); C04B 2235/3234 (2013.01); C04B 2235/3236 (2013.01); C04B 2235/3239 (2013.01); C04B 2235/3241 (2013.01); C04B 2235/3249 (2013.01); C04B 2235/3251 (2013.01); C04B 2235/3262 (2013.01); C04B 2235/3275 (2013.01); C04B 2235/3279 (2013.01); C04B 2235/3281 (2013.01); C04B 2235/3287 (2013.01); C04B 2235/6025 (2013.01); C04B 2235/656 (2013.01); C04B 2235/6567 (2013.01); C04B 2235/6586 (2013.01); C04B 2235/663 (2013.01); C04B 2235/80 (2013.01); C04B 2235/85 (2013.01);
Abstract
The present disclosure provides a ceramic sintered body having a favorable dielectric constant. In some embodiments of the present disclosure, the ceramic sintered body includes a semiconductor ceramic phase dispersed in a dielectric ceramic phase, wherein the semiconductor ceramic phase and the dielectric ceramic phase jointly form a percolative composite, and a volume fraction of the semiconductor ceramic phase is close to and less than a percolation threshold.