The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 23, 2020

Filed:

Oct. 07, 2019
Applicant:

Vishay Dale Electronics, Llc, Columbus, NE (US);

Inventors:

Todd L. Wyatt, Columbus, NE (US);

Darin W. Glenn, Columbus, NE (US);

Assignee:

Vishay Dale Electronics, LLC, Columbus, NE (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01C 1/084 (2006.01); H01C 1/034 (2006.01); H01C 1/01 (2006.01); H01C 17/02 (2006.01); H01C 1/148 (2006.01); H01C 17/28 (2006.01); C22C 9/00 (2006.01);
U.S. Cl.
CPC ...
H01C 1/084 (2013.01); H01C 1/01 (2013.01); H01C 1/034 (2013.01); H01C 1/148 (2013.01); H01C 17/02 (2013.01); H01C 17/28 (2013.01); C22C 9/00 (2013.01);
Abstract

Resistors and a method of manufacturing resistors are described herein. A resistor includes a resistive element and a plurality of upper heat dissipation elements. The plurality of heat dissipation elements are electrically insulated from one another via a dielectric material and thermally coupled to the resistive element via an adhesive material disposed between each of the plurality of heat dissipation elements and a surface of the resistive element. Electrode layers are provided on a bottom surface of the resistive element. Solderable layers form side surfaces of the resistor and assist in thermally coupling the heat dissipation elements, the resistor and the electrode layers.


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