The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 23, 2020

Filed:

May. 01, 2019
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Terence B. Hook, Jericho, VT (US);

Larry Wissel, Williston, VT (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06F 17/50 (2006.01); G06F 30/398 (2020.01); G06F 30/392 (2020.01);
U.S. Cl.
CPC ...
G06F 30/398 (2020.01); G06F 30/392 (2020.01);
Abstract

Methods and systems for checking a wafer-level design for compliance with a rule include determining a tile area, having a size that is based on the one or more layout design rules, that crosses a boundary between adjacent chip layouts and that leaves at least a portion of each chip layout uncovered. It is determined that a portion of a first chip layout inside the tile area fails to comply with one or more layout design rules. The first chip layout is modified, responsive to the determination that the first chip layout within the tile area fails to comply with the one or more layout design rules, to bring non-compliant periphery chip regions into compliance. It is determined that the portion of the first chip layout within the tile area complies with the one or more design rules after modifying the first chip layout. A multi-chip wafer is fabricated that includes the chip layouts.


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