The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 23, 2020
Filed:
Dec. 22, 2016
Applicant:
Fujikura Ltd., Tokyo, JP;
Inventors:
Shinsuke Aoshima, Chiba, JP;
Kazutoshi Koshimizu, Chiba, JP;
Assignee:
Fujikura Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/02 (2006.01); H05K 3/10 (2006.01); G06F 3/044 (2006.01); H05K 1/09 (2006.01); H05K 1/02 (2006.01); H05K 3/12 (2006.01);
U.S. Cl.
CPC ...
G06F 3/044 (2013.01); H05K 1/0225 (2013.01); H05K 1/0296 (2013.01); H05K 1/092 (2013.01); H05K 3/1216 (2013.01); H05K 3/1241 (2013.01); H05K 3/1275 (2013.01); G06F 2203/04103 (2013.01); G06F 2203/04107 (2013.01); G06F 2203/04112 (2013.01); H05K 2201/09681 (2013.01); Y10T 29/49155 (2015.01);
Abstract
A method is provided for manufacturing a wiring board that includes a conductor part including a first line and a second line wider than the first line. The method includes: a first process of forming the first line and a boundary line corresponding to at least a portion of an outline of the second line near the first line; and a second process of forming a remaining portion of the second line.