The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 23, 2020
Filed:
May. 08, 2017
Ngk Spark Plug Co., Ltd., Nagoya-shi, Aichi, JP;
Junichirou Kanematsu, Kounan, JP;
Kenji Suzuki, Ichinomiya, JP;
NGK SPARK PLUG CO., LTD., Nagoya, JP;
Abstract
Provided is a multilayer wiring board for inspection of electronic components which has excellent reliability by improving the adhesiveness between a resin wiring portion and a ceramic wiring substrate. A multilayer wiring boardaccording to the present invention includes: a ceramic wiring substratehaving a substrate main surfaceand a substrate rear surface; substrate-side conductive layersformed on the substrate main surface; and a resin wiring portionstacked on the substrate main surfaceso as to cover the substrate-side conductive layers. Inspection padsfor inspection of electronic components are formed on a front surfaceof the resin wiring portion. End surfaces of the substrate-side conductive layersare exposed from side surfacesof the multilayer wiring board. An outer peripheral edge of a rear surface of the resin wiring portionis in contact with the surfaces of the substrate-side conductive layers, and end surfaces of the resin wiring portionand the end surfaces of the substrate-side conductive layersare positioned closer to the center of the board than end surfacesof the ceramic wiring substrate