The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 23, 2020
Filed:
Aug. 19, 2016
Applicant:
Henkel Ag & Co. Kgaa, Duesseldorf, DE;
Inventors:
Shingo Tsuno, Kanagawa, JP;
Masaaki Dobashi, Yokohama, JP;
Takahide Morishita, Osaka, JP;
Tomonori Takahashi, Tokyo, JP;
Assignee:
Henkel AG & Co. KGaA, Duesseldorf, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 175/08 (2006.01); C08G 18/40 (2006.01); C08G 18/48 (2006.01); C08G 18/42 (2006.01); C08G 18/62 (2006.01); C09J 139/06 (2006.01); C09J 133/10 (2006.01); C09J 175/04 (2006.01); C08L 33/00 (2006.01); C08L 75/04 (2006.01);
U.S. Cl.
CPC ...
C09J 175/08 (2013.01); C08G 18/4018 (2013.01); C08G 18/4063 (2013.01); C08G 18/42 (2013.01); C08G 18/4808 (2013.01); C08G 18/4833 (2013.01); C08G 18/6225 (2013.01); C08L 33/00 (2013.01); C08L 75/04 (2013.01); C09J 133/10 (2013.01); C09J 139/06 (2013.01); C09J 175/04 (2013.01); C08G 2170/20 (2013.01);
Abstract
An object of the present invention is to provide a moisture-curable hot melt adhesive which can substantially suppress generation of carbon dioxide bubbles by a reaction of an isocyanate compound and moisture as well as volume expansion when an uncured adhesive is heated. The present invention relates to a moisture-curable hot melt adhesive for lighting appliances comprising: an urethane prepolymer obtained by mixing a polyol compound and an isocyanate compound, a thermoplastic polyacrylic resin and an oxazolidine compound.