The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 23, 2020

Filed:

Sep. 11, 2015
Applicant:

Riken Technos Corporation, Tokyo, JP;

Inventors:

Jun Fujimoto, Tokyo, JP;

Nozomu Washio, Tokyo, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C08J 7/04 (2020.01); C09D 133/10 (2006.01); B05D 3/14 (2006.01); C09D 7/40 (2018.01); B32B 27/00 (2006.01); B32B 27/16 (2006.01); C09J 133/26 (2006.01); C09D 4/00 (2006.01); C09J 7/38 (2018.01); B32B 27/20 (2006.01); B32B 7/12 (2006.01); B32B 27/08 (2006.01); B32B 27/28 (2006.01); C09J 7/20 (2018.01); C09J 7/21 (2018.01); B32B 7/04 (2019.01); C09J 7/28 (2018.01); C09J 7/25 (2018.01); C09J 7/26 (2018.01); B32B 27/32 (2006.01); B32B 27/36 (2006.01); B32B 27/30 (2006.01); C09J 7/22 (2018.01);
U.S. Cl.
CPC ...
C09D 7/40 (2018.01); B32B 7/04 (2013.01); B32B 7/12 (2013.01); B32B 27/00 (2013.01); B32B 27/08 (2013.01); B32B 27/16 (2013.01); B32B 27/20 (2013.01); B32B 27/281 (2013.01); B32B 27/308 (2013.01); B32B 27/32 (2013.01); B32B 27/36 (2013.01); B32B 27/365 (2013.01); C09D 4/00 (2013.01); C09J 7/201 (2018.01); C09J 7/203 (2018.01); C09J 7/21 (2018.01); C09J 7/22 (2018.01); C09J 7/25 (2018.01); C09J 7/26 (2018.01); C09J 7/28 (2018.01); C09J 7/38 (2018.01); C09J 7/385 (2018.01); C09J 133/26 (2013.01); B32B 2250/02 (2013.01); B32B 2250/03 (2013.01); B32B 2250/24 (2013.01); B32B 2255/10 (2013.01); B32B 2255/24 (2013.01); B32B 2255/26 (2013.01); B32B 2255/28 (2013.01); B32B 2270/00 (2013.01); B32B 2307/21 (2013.01); B32B 2307/306 (2013.01); B32B 2307/402 (2013.01); B32B 2307/412 (2013.01); B32B 2307/518 (2013.01); B32B 2307/536 (2013.01); B32B 2307/546 (2013.01); B32B 2307/554 (2013.01); B32B 2307/712 (2013.01); B32B 2307/728 (2013.01); B32B 2307/732 (2013.01); B32B 2307/734 (2013.01); B32B 2457/20 (2013.01); B32B 2457/208 (2013.01); C09J 2201/622 (2013.01); C09J 2203/318 (2013.01); C09J 2479/086 (2013.01); C09J 2483/00 (2013.01);
Abstract

Embodiments provide a pressure-sensitive adhesive film having (α) a poly(meth)acrylimide-based resin film layer and (γ) a pressure-sensitive adhesive agent layer in that order from the surface layer side and having a total light transmittance of 80% or higher. The pressure-sensitive adhesive film may further have (δ) a hard coat layer on the surface layer side of the poly(meth)acrylimide-based resin film layer (α). This hard coat layer (δ) may comprise an active energy ray-curable resin composition that contains (A) 100 parts by mass of a polyfunctional (meth)acrylate; (B) 0.2-4 parts by mass of a compound having an alkoxysilyl group and a (meth)acryloyl group; (C) 0.05-3 parts by mass of organic titanium; and (D) 5-100 parts by mass of fine particles having an average particle diameter of 1-300 nm. This active energy ray-curable resin composition may further contain (E) 0.01-7 parts by mass of a water-repelling agent.


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