The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 23, 2020
Filed:
Mar. 16, 2016
Applicant:
The University of Liverpool, Liverpool, GB;
Inventors:
Matthew J. Rosseinsky, Liverpool, GB;
Pranab Mandal, Liverpool, GB;
Jonathan Alaria, Liverpool, GB;
John Claridge, Liverpool, GB;
Michael Pitcher, Liverpool, GB;
Assignee:
THE UNIVERSITY OF LIVERPOOL, Liverpool, GB;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C04B 35/26 (2006.01); H01F 1/40 (2006.01); H01F 10/193 (2006.01); C04B 35/622 (2006.01); C04B 35/626 (2006.01); C04B 35/634 (2006.01); C04B 35/64 (2006.01); H01L 27/11507 (2017.01); H01L 27/22 (2006.01); H01L 49/02 (2006.01); H01L 43/08 (2006.01); H01L 43/10 (2006.01); H01L 43/12 (2006.01);
U.S. Cl.
CPC ...
C04B 35/2683 (2013.01); C04B 35/6261 (2013.01); C04B 35/6264 (2013.01); C04B 35/62218 (2013.01); C04B 35/62695 (2013.01); C04B 35/6342 (2013.01); C04B 35/64 (2013.01); H01F 1/407 (2013.01); H01F 10/1933 (2013.01); H01L 27/11507 (2013.01); H01L 27/222 (2013.01); H01L 28/55 (2013.01); H01L 43/08 (2013.01); H01L 43/10 (2013.01); H01L 43/12 (2013.01); C04B 2235/3206 (2013.01); C04B 2235/3208 (2013.01); C04B 2235/3236 (2013.01); C04B 2235/3274 (2013.01); C04B 2235/3298 (2013.01); C04B 2235/85 (2013.01);
Abstract
The present invention relates to new multiferroic materials. More particularly, the present invention relates to new multiferroic single phase ceramic materials as well as to thin films formed from these materials, methods of preparing these materials and their use as multiferroic materials in electronic components and devices.