The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 23, 2020

Filed:

Sep. 28, 2018
Applicant:

Hewlett-packard Development Company, L.p., Houston, TX (US);

Inventors:

Pablo Vidal Alvarez, Sant Cugat del Valles, ES;

Daniel Gutierrez Garcia, Sant Cugat del Valles, ES;

Emilio Angulo Navarro, Sant Cugat del Valles, ES;

Vicente Serra Jorro, Sant Cugat del Valles, ES;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 11/00 (2006.01); B41J 3/407 (2006.01); B33Y 50/02 (2015.01); B33Y 10/00 (2015.01);
U.S. Cl.
CPC ...
B41J 11/002 (2013.01); B41J 3/407 (2013.01); B33Y 10/00 (2014.12); B33Y 50/02 (2014.12);
Abstract

Adaptative substrate curing by ejecting a curing flow rate to a curing zone by: heating a heating fluid to a curing temperature; causing the heating fluid to flow along a plurality of serially connected chambers separated being each pair of chambers separated by a heating fluid restrictor, actuating on the heating fluid restrictor as to determine a restricted flow rate between adjacent chambers thereby defining a curing flow rate that passes from the chambers towards the curing zone.


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