The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 23, 2020

Filed:

Oct. 03, 2017
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Vijay D. Parkhe, San Jose, CA (US);

Roger Alan Lindley, Santa Clara, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/24 (2006.01); B32B 3/26 (2006.01); B32B 5/18 (2006.01); H01L 21/683 (2006.01); H01L 21/687 (2006.01); B32B 7/12 (2006.01);
U.S. Cl.
CPC ...
B32B 3/266 (2013.01); B32B 5/18 (2013.01); B32B 7/12 (2013.01); H01L 21/6833 (2013.01); H01L 21/68757 (2013.01); H01L 21/68785 (2013.01);
Abstract

The present disclosure is a method of bonding an electrostatic chuck to a temperature control base. According to the embodiments, a bonding layer is formed between a dielectric body comprising the electrostatic chuck and a temperature control base. A flow aperture extends through the dielectric body and is aligned with a flow aperture in the temperature control base. The bonding layer is also configured with an opening that aligns with apertures in the dielectric body and the temperature control base. In one aspect, a porous plug may be disposed within the flow aperture to protect the bonding layer. In another aspect, a seal is disposed within the flow aperture to seal off the boding layer from gases in the flow aperture.


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