The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 23, 2020

Filed:

Jul. 31, 2017
Applicant:

Ngk Insulators, Ltd., Nagoya, JP;

Inventors:

Yuta Imaizumi, Nagoya, JP;

Kazuhiko Hamatsuka, Nagoya, JP;

Assignee:

NGK Insulators, Ltd., Nagoya, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 48/11 (2019.01); B28B 3/26 (2006.01); B29C 48/30 (2019.01); B29C 48/00 (2019.01); B29L 31/60 (2006.01);
U.S. Cl.
CPC ...
B29C 48/11 (2019.02); B28B 3/269 (2013.01); B29C 48/022 (2019.02); B29C 48/30 (2019.02); B29L 2031/608 (2013.01);
Abstract

The honeycomb structure forming die includes a first die in which a central region on the side of a kneaded material discharging surface has a convex region projecting toward a downstream side in an extruding direction of a kneaded material, a ring-shaped second die, and a reticulated member interposed between the first die and the second die. In the first die, first kneaded material introducing holes are formed and latticed first slits are formed on the side of the kneaded material discharging surface of the convex region, and in the second die, there are formed second kneaded material introducing holes and latticed second slits communicating with the second kneaded material introducing holes, and movement of a kneaded material is performed between the first kneaded material introducing hole and the second kneaded material introducing hole through meshes of the reticulated member.


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