The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 16, 2020

Filed:

Jan. 24, 2018
Applicant:

Idex Asa, Fornebu, NO;

Inventors:

Fred G. Benkley, III, Andover, MA (US);

David N. Light, Los Gatos, CA (US);

David Joseph Geoffroy, Amherst, MA (US);

Massimo Eugenio Ravelli, East Longmeadow, MA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 1/11 (2006.01); H05K 1/02 (2006.01); G06K 9/00 (2006.01); H04M 1/67 (2006.01); H04M 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 1/183 (2013.01); G06K 9/00006 (2013.01); H04M 1/026 (2013.01); H04M 1/0277 (2013.01); H04M 1/67 (2013.01); H05K 1/0298 (2013.01); H05K 1/111 (2013.01); H05K 1/181 (2013.01); H05K 2201/099 (2013.01); H05K 2201/1003 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10151 (2013.01); H05K 2201/10545 (2013.01); H05K 2201/10719 (2013.01); H05K 2201/10734 (2013.01);
Abstract

A fingerprint sensor module includes a fingerprint sensor assembly with a circuit element attached. The fingerprint sensor assembly is electrically connected to a printed circuit board (PCB) substrate with a cutout to accommodate the circuit element. The entire fingerprint sensor assembly and at least part of the PCB are encapsulated in a encapsulating material to produce a structurally robust fingerprint sensor module suitable for integration into an electronics device such as a smartphone or other 'Internet of Things' (IOT) electronic device.


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