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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10687424 B1

PDFFull Text
Date of Patent:
Jun. 16, 2020

Filed:

Jan. 24, 2018

Configurable, encapsulated sensor module and method for making same

Applicant:

Idex Asa, Fornebu, NO;

Inventors:

Fred G. Benkley, III, Andover, MA (US);

David N. Light, Los Gatos, CA (US);

David Joseph Geoffroy, Amherst, MA (US);

Massimo Eugenio Ravelli, East Longmeadow, MA (US);

Assignee:

IDEX Biometrics ASA, Oslo, NO;

Attorney:

Rothwell, Figg, Ernst & Manbeck, P.C.

Primary Examiner:

Ming Y Hon

Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 1/11 (2006.01); H05K 1/02 (2006.01); G06K 9/00 (2006.01); H04M 1/67 (2006.01); H04M 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 1/183 (2013.01); G06K 9/00006 (2013.01); H04M 1/026 (2013.01); H04M 1/0277 (2013.01); H04M 1/67 (2013.01); H05K 1/0298 (2013.01); H05K 1/111 (2013.01); H05K 1/181 (2013.01); H05K 2201/099 (2013.01); H05K 2201/1003 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10151 (2013.01); H05K 2201/10545 (2013.01); H05K 2201/10719 (2013.01); H05K 2201/10734 (2013.01);
Abstract

A fingerprint sensor module includes a fingerprint sensor assembly with a circuit element attached. The fingerprint sensor assembly is electrically connected to a printed circuit board (PCB) substrate with a cutout to accommodate the circuit element. The entire fingerprint sensor assembly and at least part of the PCB are encapsulated in a encapsulating material to produce a structurally robust fingerprint sensor module suitable for integration into an electronics device such as a smartphone or other 'Internet of Things' (IOT) electronic device.

Find Patent Forward Citations

Benkley, III, Fred. (2020). Configurable, encapsulated sensor module and method for making same (U.S. Patent No. 10687424). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10687424

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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