The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 16, 2020

Filed:

Jun. 05, 2017
Applicant:

Dalian Canglong Optoelectronics Technologies Co., Ltd, Dalian, Liaoning, CN;

Inventors:

Hao Wang, Liaoning, CN;

Shun Zhang, Liaoning, CN;

Lin Cui, Liaoning, CN;

Wenchen Zhang, Liaoning, CN;

Chuanwu Liao, Liaoning, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/14 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0251 (2013.01); H05K 1/118 (2013.01); H05K 2201/094 (2013.01); H05K 2201/09609 (2013.01); H05K 2201/09672 (2013.01); H05K 2201/09727 (2013.01);
Abstract

A flexible printed circuit board is disclosed, which includes a pad portion, wherein the pad portion includes a pair of first signal pads formed in a first conductor layer and respectively connected with a pair of signal wires, a pair of second signal pads formed in a second conductor layer and electrically separated from a grounding layer; a pair of first grounding pads formed in the first conductor layer and electrically separated from the pair of signal wires, wherein: the pair of first signal pads is sandwiched between the pair of first grounding pads, and a pair of second grounding pads formed in the second conductor layer and connected with the grounding layer, wherein the pair of second signal pads are sandwiched between the pair of second grounding pads. A width of the first and the second signal pads is larger than that of the signal wires.


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