The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 16, 2020

Filed:

Jan. 13, 2016
Applicant:

Epcos Ag, Munich, DE;

Inventors:

Marion Ottlinger, Deutschlandsberg, AT;

Peter Windisch, Deutschlandsberg, AT;

Assignee:

EPCOS AG, Munich, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 41/22 (2013.01); H01L 41/273 (2013.01); H01L 41/33 (2013.01); H01L 41/047 (2006.01); H01L 41/083 (2006.01); H01L 41/187 (2006.01); H01L 41/297 (2013.01); H01L 41/312 (2013.01);
U.S. Cl.
CPC ...
H01L 41/273 (2013.01); H01L 41/047 (2013.01); H01L 41/0838 (2013.01); H01L 41/1876 (2013.01); H01L 41/297 (2013.01); H01L 41/312 (2013.01); H01L 41/33 (2013.01); Y10T 29/42 (2015.01);
Abstract

The present invention relates to a method for producing piezoelectric multi-layered components (), which comprises the following steps: applying an electrode material () to green sheets () containing a piezoelectric material, applying a layer of a first auxiliary material () to at least one green sheet () containing the piezoelectric material, forming a stack (), in which the green sheets (), to which electrode material () is applied, are arranged one on top of another, wherein at least one ply of the green sheet (), to which the layer of the first auxiliary material () is applied, is arranged in the stack (), sintering the stack (), wherein the layer of the first auxiliary material () is thinned, and firing the stack (), wherein the stack () is singulated along the at least one ply into at least two multi-layered components ().


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