The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 16, 2020

Filed:

Oct. 18, 2018
Applicant:

Canon Kabushiki Kaisha, Tokyo, JP;

Inventor:

Nobuyuki Endo, Fujisawa, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/0264 (2006.01); H01L 31/0352 (2006.01); H01L 31/18 (2006.01); H01L 31/0232 (2014.01); H01L 31/036 (2006.01); H01L 27/146 (2006.01);
U.S. Cl.
CPC ...
H01L 31/0264 (2013.01); H01L 27/1461 (2013.01); H01L 27/14689 (2013.01); H01L 27/14698 (2013.01); H01L 31/02327 (2013.01); H01L 31/036 (2013.01); H01L 31/035272 (2013.01); H01L 31/18 (2013.01); H01L 27/14643 (2013.01);
Abstract

A photoelectric conversion device comprises a semiconductor substrate including a photoelectric conversion portion, a silicon oxide film arranged above the photoelectric conversion portion, and an insulating film arranged between the photoelectric conversion portion and the silicon oxide film. An n-type first impurity region constituting part of the photoelectric conversion portion and a p-type second impurity region arranged between the insulating film and the first impurity region are provided in the semiconductor substrate. A portion of the insulating film above the second impurity region, and the second impurity region contain boron. An integrated value of a boron concentration from the surface of the semiconductor substrate to a first position where a boron concentration takes a minimal value in the second impurity region is larger than that from the surface of the semiconductor substrate to an upper surface of the silicon oxide film.


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