The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 16, 2020
Filed:
Apr. 20, 2018
Samsung Electro-mechanics Co., Ltd., Suwon-Si, Gyeonggi-Do, KR;
Chang Hwa Park, Suwon-Si, KR;
Ga Young Yoo, Suwon-Si, KR;
Sang Ah Kim, Suwon-Si, KR;
Yu Rim Choi, Suwon-Si, KR;
SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, Gyeonggi-Do, KR;
Abstract
A semiconductor package includes: a semiconductor chip having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the semiconductor chip; and a connection member including a first insulating layer disposed on the active surface of the semiconductor chip, a first redistribution layer disposed on the first insulating layer, first vias penetrating through the first insulating layer and electrically connecting the connection pads and the first redistribution layer to each other, and a first insulating film covering the first insulating layer and the first redistribution layer. The first insulating film includes a silicon based compound.