The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 16, 2020

Filed:

Aug. 23, 2017
Applicant:

Ampleon Netherlands B.v., Nijmegen, NL;

Assignee:

Ampleon Netherlands B.V., Nijmegen, NL;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03F 3/191 (2006.01); H01L 23/66 (2006.01); H03F 1/02 (2006.01); H03F 1/56 (2006.01); H03F 3/195 (2006.01); H01L 23/00 (2006.01); H01L 25/18 (2006.01); H01L 49/02 (2006.01);
U.S. Cl.
CPC ...
H01L 23/66 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 25/18 (2013.01); H01L 28/40 (2013.01); H03F 1/0205 (2013.01); H03F 1/0288 (2013.01); H03F 1/565 (2013.01); H03F 3/195 (2013.01); H01L 2223/6611 (2013.01); H01L 2223/6655 (2013.01); H01L 2223/6661 (2013.01); H01L 2223/6672 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/49175 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/1033 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/13064 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/19011 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/30111 (2013.01); H03F 2200/216 (2013.01); H03F 2200/222 (2013.01); H03F 2200/225 (2013.01); H03F 2200/267 (2013.01); H03F 2200/297 (2013.01); H03F 2200/301 (2013.01); H03F 2200/306 (2013.01); H03F 2200/309 (2013.01); H03F 2200/387 (2013.01); H03F 2200/391 (2013.01); H03F 2200/402 (2013.01); H03F 2200/451 (2013.01); H03F 2200/75 (2013.01);
Abstract

A packaged RF power amplifier comprises an output network coupled to the output of a RF power transistor, which output network comprises a plurality of first bondwires extending along a first direction between the output of transistor and an output lead of the package, a series connection of a second inductor and a first capacitor between the output of the RF power transistor and ground, and a series connection of a third inductor and a second capacitor connected in between ground and the junction between the second inductor and the first capacitor. The first and second capacitors are integrated on a single passive die and the third inductor comprises a first part and a second part connected in series, wherein the first part extends at least partially along the first direction, and wherein the second part extends at least partially in a direction opposite to the first direction.


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