The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 16, 2020
Filed:
Aug. 24, 2017
Applicant:
Qualcomm Incorporated, San Diego, CA (US);
Inventors:
Jon Bradley Lasiter, Stockton, CA (US);
Ravindra Vaman Shenoy, Dublin, CA (US);
Donald William Kidwell, Jr., Los Gatos, CA (US);
Mohammad Ali Tassoudji, San Diego, CA (US);
Mario Francisco Velez, San Diego, CA (US);
Assignee:
QUALCOMM Incorporated, San Diego, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 9/04 (2006.01); H01L 23/66 (2006.01); H01L 23/31 (2006.01); H01L 25/16 (2006.01); H01L 21/683 (2006.01); H01L 23/00 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/538 (2006.01); H01L 25/10 (2006.01); H01L 25/00 (2006.01); H01Q 1/22 (2006.01); H01Q 21/28 (2006.01);
U.S. Cl.
CPC ...
H01L 23/66 (2013.01); H01L 21/4853 (2013.01); H01L 21/4857 (2013.01); H01L 21/565 (2013.01); H01L 21/568 (2013.01); H01L 21/6835 (2013.01); H01L 23/31 (2013.01); H01L 23/3114 (2013.01); H01L 23/5383 (2013.01); H01L 23/5386 (2013.01); H01L 23/5389 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01L 25/105 (2013.01); H01L 25/16 (2013.01); H01L 25/50 (2013.01); H01Q 1/2283 (2013.01); H01Q 9/0407 (2013.01); H01L 2221/68345 (2013.01); H01L 2221/68359 (2013.01); H01L 2221/68381 (2013.01); H01L 2223/6616 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/18 (2013.01); H01L 2224/214 (2013.01); H01L 2225/1035 (2013.01); H01L 2225/1058 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/18162 (2013.01); H01Q 21/28 (2013.01);
Abstract
An package and related methods are disclosed. The package may include an antenna, an insert made of low-loss material, and a mold, wherein the mold directly contacts and surrounds at least a portion of the insert, wherein the antenna is formed of conductive material disposed at least in part on a surface of the insert.