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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10685892 B1

PDFFull Text
Date of Patent:
Jun. 16, 2020

Filed:

Sep. 28, 2019

Methods and systems to improve printed electrical components and for integration in circuits

Applicant:

Vq Research, Inc., Palo Alto, CA (US);

Inventor:

John L. Gustafson, Santa Clara, CA (US);

Assignee:

VQ RESEARCH, INC., Palo Alto, CA (US);

Attorney:
Primary Examiner:

Andargie M Aychillhum

Int. Cl.
CPC ...
H01L 23/552 (2006.01); H01L 23/055 (2006.01); H01L 23/15 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); H05K 1/02 (2006.01); H01L 23/60 (2006.01); H05K 3/12 (2006.01); H05K 3/22 (2006.01); H01F 27/28 (2006.01); H01F 27/24 (2006.01); H01C 7/18 (2006.01); H01G 4/30 (2006.01); H01G 4/005 (2006.01); H01G 4/012 (2006.01); H01G 4/232 (2006.01); G06F 30/392 (2020.01); G06F 30/398 (2020.01); H05K 1/16 (2006.01); H01G 4/12 (2006.01);
U.S. Cl.
CPC ...
H01L 23/055 (2013.01); G06F 30/392 (2020.01); G06F 30/398 (2020.01); H01C 7/18 (2013.01); H01F 27/24 (2013.01); H01F 27/2804 (2013.01); H01G 4/005 (2013.01); H01G 4/012 (2013.01); H01G 4/232 (2013.01); H01G 4/30 (2013.01); H01L 21/4807 (2013.01); H01L 21/4846 (2013.01); H01L 23/15 (2013.01); H01L 23/49816 (2013.01); H01L 23/49838 (2013.01); H01L 23/60 (2013.01); H01L 24/16 (2013.01); H05K 1/0218 (2013.01); H05K 3/1283 (2013.01); H05K 3/227 (2013.01); H01G 4/1227 (2013.01); H01L 2224/131 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/73253 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/15787 (2013.01); H01L 2924/16251 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19043 (2013.01); H01L 2924/3025 (2013.01); H05K 1/162 (2013.01); H05K 1/165 (2013.01); H05K 1/167 (2013.01);
Abstract

Methods and systems to improve printed electrical components and for integration in circuits are disclosed. Passive components, e.g., capacitors, resistors and inductors, can be printed directly into a solid ceramic block using additive manufacturing. A grounded conductive plane or a conductive cage may be placed between adjacent electrical components, or around each component, to minimize unwanted parasitic effects in the circuits, such as, e.g., parasitic capacitance or parasitic inductance. Resistors may be printed in non-traditional shapes, for example, S-shape, smooth S-shape, U-shape, V-shape, Z-shape, zigzag-shape, and any other acceptable alternative configurations. The flexibility in shapes and sizes of the printed resistors allows optimal space usage of the ceramic block. The present invention also discloses an electrical component comprising combined predetermined values of capacitance, resistance and inductance. The integration and adjustability of a multi-property device can provide significant advantages in electronics manufacturing.

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