The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 16, 2020
Filed:
Aug. 10, 2018
Toshiba Memory Corporation, Minato-ku, Tokyo, JP;
Masaaki Hatano, Yokkaichi Mie, JP;
TOSHIBA MEMORY CORPORATION, Tokyo, JP;
Abstract
A semiconductor device includes a first semiconductor substrate, a first insulating film provided at the first semiconductor substrate and including a first recess portion on a surface portion thereof, a first metal film provided at the first recess portion and having a first surface exposed from the first insulating film, a second semiconductor substrate, a second insulating film provided at the second semiconductor substrate and including a second recess portion on a surface portion thereof, a second metal film provided at the second recess portion and having a second surface exposed from the second insulating film, first anti-diffusion films, and second anti-diffusion films provided at outer circumferential portions of the first anti-diffusion films. The second surface is joined to the first surface. The first anti-diffusion films are provided at the first recess portion and the second recess portion and cover the first metal film and the second metal film.