The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 16, 2020

Filed:

Aug. 23, 2017
Applicant:

Honeywell International Inc., Morris Plains, NJ (US);

Inventors:

Richard Wade, Worthington, OH (US);

Jason D. Patch, Columbus, OH (US);

Assignee:

HONEYWELL INTERNATIONAL INC., Morris Plains, NJ (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01L 9/00 (2006.01); G01L 19/06 (2006.01); G01L 19/14 (2006.01);
U.S. Cl.
CPC ...
G01L 9/0044 (2013.01); G01L 19/0645 (2013.01); G01L 19/0654 (2013.01); G01L 19/148 (2013.01);
Abstract

A pressure sensor assembly having a printed circuit board (PCB) with a pressure sensor mounted on the PCB, a side wall engaging the PCB, a membrane, a cavity defined by the membrane, the side wall and the PCB, and a gel or liquid filling the cavity. The pressure sensor assembly may include a fill-hole extending into the cavity through which the cavity may be filled with the gel or liquid. The fill-hole may extend through one or both of the PCB and/or the side wall. The cavity is defined in part by a septum that allows a needle to pierce the septum for filling the cavity with the gel or liquid. A method of forming the pressure sensor assembly may include filling a cavity of the pressure sensor assembly with a gel or liquid through a fill-hole and curing the gel or liquid once in the cavity.


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