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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10683414 B1

PDFFull Text
Date of Patent:
Jun. 16, 2020

Filed:

Jan. 21, 2015

Resin composition

Applicant:

Denka Company Limited, Tokyo, JP;

Inventors:

Takako Hoshino, Shibukawa, JP;

Yuki Hisha, Shibukawa, JP;

Yoshitsugu Goto, Shibukawa, JP;

Assignee:

DENKA COMPANY LIMITED, Tokyo, JP;

Attorney:

Stein IP, LLC

Primary Examiner:

John D Freeman

Int. Cl.
CPC ...
C08L 63/00 (2006.01); B32B 27/38 (2006.01); H01L 51/00 (2006.01); C09D 163/00 (2006.01); C08G 59/22 (2006.01); C08K 5/1515 (2006.01); C08G 59/40 (2006.01); C08G 59/06 (2006.01); C09J 163/00 (2006.01); C08G 59/68 (2006.01); H01L 51/52 (2006.01); H01L 51/10 (2006.01); H01L 51/56 (2006.01);
U.S. Cl.
CPC ...
C08L 63/00 (2013.01); C08G 59/063 (2013.01); C08G 59/226 (2013.01); C08G 59/4085 (2013.01); C08K 5/1515 (2013.01); C09D 163/00 (2013.01); C09J 163/00 (2013.01); H01L 51/0035 (2013.01); B32B 27/38 (2013.01); B32B 2305/30 (2013.01); B32B 2457/206 (2013.01); C08G 59/687 (2013.01); C09J 2203/326 (2013.01); H01L 51/107 (2013.01); H01L 51/5246 (2013.01); H01L 51/5253 (2013.01); H01L 51/56 (2013.01);
Abstract

A resin composition is provided that is capable of inhibiting degradation of the organic EL device. The resin composition, includes: (A) an alicyclic epoxy compound; (B) a bisphenol A epoxy resin; (C) a bisphenol F epoxy resin; and (D) a photocationic polymerization initiator. The bisphenol A epoxy resin (B) and the bisphenol F epoxy resin (C) are compounds not having the alicyclic epoxy compound (A) and the resin composition has a moisture content of 1000 ppm or less. Alternatively, the resin composition may further include a filler (H) and may have a moisture content of 50 ppm or more.

Find Patent Forward Citations

Hoshino, Takako. (2020). Resin composition (U.S. Patent No. 10683414). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10683414

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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