The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 16, 2020
Filed:
Nov. 04, 2014
Corning Precision Materials Co., Ltd., Chungcheongnam-do, KR;
Jae Seon Hong, Chungcheongnam-do, KR;
Myung Hwan Kim, Chungcheongnam-do, KR;
Bong Chul Kim, Chungcheongnam-do, KR;
Jong Hwa Kim, Chungcheongnam-do, KR;
Duck Kyo Seo, Chungcheongnam-do, KR;
Jae Mun Hwang, Chungcheongnam-do, KR;
Abstract
The present invention relates to an apparatus for molding a glass substrate, and more specifically, to an apparatus for molding a glass substrate capable of forming a glass substrate in a 3D shape and preventing the shape of a vacuum hole from transferring onto the surface of the substrate. To this end, the present invention provides the apparatus for shaping a glass substrate, comprising: a molding frame having a cavity, at least one vacuum hole and at least one decompression hole, wherein the cavity disposed on one surface of the molding frame, the at least one vacuum hole formed in the molding frame below the cavity, the at least one vacuum hole being connected to an external vacuum device, and the at least one decompression hole defined between the cavity and the at least one vacuum hole such that the cavity communicates with the at least one vacuum hole, wherein a width of the at least one decompression hole is greater than a width of the at least one vacuum hole such that the at least one decompression hole lessens vacuum pressure applied to the glass substrate disposed on the cavity through the at least one vacuum hole, wherein all of the at least one vacuum hole are connected to the at least one decompression hole.