The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 16, 2020
Filed:
Sep. 30, 2015
Applicant:
Tdk Corporation, Tokyo, JP;
Inventors:
Pirmin Hermann Otto Rombach, Kongens Lyngby, DK;
Kurt Rasmussen, Herlev, DK;
Anton Leidl, Hohenbrunn, DE;
Wolfgang Pahl, München, DE;
Dennis Mortensen, Frederiksberg C, DK;
Assignee:
TDK Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B81B 7/00 (2006.01); H01L 23/00 (2006.01); B81B 3/00 (2006.01);
U.S. Cl.
CPC ...
B81B 7/0048 (2013.01); B81B 3/0018 (2013.01); H01L 24/34 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/1433 (2013.01); H01L 2924/1461 (2013.01);
Abstract
A MEMS device having a sensor system that is resiliently mounted on a carrier by means of spring elements. The air gap between sensor system and carrier is reduced by a damping structure present on one of facing surfaces of sensor system and carrier. The spring elements are at least partially accommodated within recesses of the damping structure. The height of the air gap is small enough to allow squeeze film damping.