The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 16, 2020
Filed:
Aug. 07, 2018
Takashi Fujita, Kanagawa, JP;
Akira Saito, Kanagawa, JP;
Kiichi Kamoda, Kanagawa, JP;
Yasutada Shitara, Kanagawa, JP;
Kazuhiko Watanabe, Tokyo, JP;
Hitoshi Iwatsuki, Kanagawa, JP;
Yuuya Endoh, Kanagawa, JP;
Kazufumi Kimura, Kanagawa, JP;
Yasuyuki Yamashita, Kanagawa, JP;
Shinnosuke Koshizuka, Kanagawa, JP;
Yuuki Kamon, Kanagawa, JP;
Nozomu Tamoto, Shizuoka, JP;
Takashi Fujita, Kanagawa, JP;
Akira Saito, Kanagawa, JP;
Kiichi Kamoda, Kanagawa, JP;
Yasutada Shitara, Kanagawa, JP;
Kazuhiko Watanabe, Tokyo, JP;
Hitoshi Iwatsuki, Kanagawa, JP;
Yuuya Endoh, Kanagawa, JP;
Kazufumi Kimura, Kanagawa, JP;
Yasuyuki Yamashita, Kanagawa, JP;
Shinnosuke Koshizuka, Kanagawa, JP;
Yuuki Kamon, Kanagawa, JP;
Nozomu Tamoto, Shizuoka, JP;
RICOH COMPANY, LTD., Tokyo, JP;
Abstract
A fabrication method includes laminating a fabrication material to form an object, and applying a release material on a surface of the object to form a release layer on the surface of the object. A surface free energy of the release material is equal to or smaller than 25 mN/m.