The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 16, 2020
Filed:
Nov. 20, 2018
Toyota Jidosha Kabushiki Kaisha, Toyota-shi, JP;
Toyota Production Engineering Corporation, Munakata-shi, JP;
Placo Co, Ltd., Saitama-shi, JP;
TOYOTA JIDOSHA KABUSHIKI KAISHA, Toyota-shi, JP;
TOYOTA PRODUCTION ENGINEERING CORPORATION, Munakata-shi, JP;
PLACO CO, LTD., Saitama-shi, JP;
Abstract
A molding apparatus includes: a die provided with a die recessed portion; a core being relatively movable toward a first side and a second side in an axial direction of the die, and forming a flow passage for molten resin between the core and the die; a slider housed in the die recessed portion, having a gap in the die radial direction between the slider and the die recessed portion, the slider being slidable in the die axial direction; and a wall portion forming part of an inner wall in the die radial direction of the die recessed portion, positioned to oppose the core, and extending in such a way that a thickness of the wall portion gradually decreases heading from the first side toward the second side; wherein the wall portion is elastically flexible outward in the die radial direction in a case in which the wall portion is pushed by the molten resin.